Alumina Ceramic Substrates Unmatched Insulation And Thermal Conductivity For High-End Applications

Alumina Ceramic Substrates Unmatched Insulation And Thermal Conductivity For High-End Applications

Product Overview

Alumina ceramic heat sink substrates are advanced electronic cooling materials manufactured from high-purity aluminum oxide (Al₂O₃). These substrates feature excellent thermal conductivity, electrical insulation, and mechanical strength. Utilizing cutting-edge ceramic processing technology, they offer superior surface flatness and thermal expansion coefficients that match semiconductor materials, making them ideal heat dissipation carriers for power electronic devices.

Key Applications

• LED Lighting: Heat sinks for high-power LED chips

• Power Electronics: IGBT modules and power semiconductor devices

• Telecom Equipment: 5G base station power amplifiers

• Automotive Electronics: New energy vehicle control systems

Product Advantages

1. Exceptional Thermal Conductivity: 24-28W/(m·K)

2. High Insulation Performance: Breakdown voltage >15kV/mm

3. Low Thermal Expansion: Matches chip expansion (7.2×10⁻⁶/℃)

4. High-Temperature Resistance: Continuous operation up to 1000℃

5. Superior Mechanical Strength: Flexural strength >300MPa

Technical Specifications

Manufacturing Process

1. Powder Preparation: Fine grinding of high-purity alumina

2. Tape Casting: Producing high-precision green tapes

3. High-Temp Sintering: 1600-1700℃ densification

4. Precision Machining: Laser cutting, surface polishing

5. Metallization: Screen printing/sputtering

6. Quality Control: Thermal/insulation testing

Usage Guidelines

1. Maintain clean surfaces during installation

2. Use thermal paste for better heat transfer

3. Avoid mechanical impacts to prevent cracking

4. Regularly inspect surface conditions

Service Commitment

• 18-month quality guarantee

• Professional technical support

• Rapid response to inquiries

• Sample testing and small-batch customization

FAQ

Q: Advantages vs aluminum substrates?
A: Better insulation, heat resistance, and dimensional stability

Q: Minimum achievable thickness?
A: 0.3mm (0.5mm recommended)

Q: Custom shapes available?
A: Yes, with minimum 0.5mm hole diameter

High Performance Alumina Ceramic

Industries Alumina Ceramic

Alumina Ceramic Substrates Unmatched Insulation And Thermal Conductivity For High-End Applications Images